Research of the recast layer on implant surface modified by micro-current electrical discharge machining using deionized water mixed with titanium powder as dielectric solvent
Autor: | Sung-Long Chen, Guo-Xin Huang, Chia-Ching Wang, Ming-Hong Lin |
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Rok vydání: | 2014 |
Předmět: |
Materials science
Metallurgy General Physics and Astronomy Surfaces and Interfaces General Chemistry Dielectric Condensed Matter Physics Surfaces Coatings and Films Titanium powder Solvent Electrical discharge machining Phase (matter) Surface modification Wetting Composite material Layer (electronics) |
Zdroj: | Applied Surface Science. 311:47-53 |
ISSN: | 0169-4332 |
DOI: | 10.1016/j.apsusc.2014.04.204 |
Popis: | Surface modification of Ti using micro-current electrical discharge machining (MC-EDM) technology at various working parameters was conducted in the present study. A significant decrease in amount of surface cracks for modified Ti in deionized water mixed with concentration of 3 g/l Ti powder dielectric solvent was determined. Increasing the concentration of Ti powder to 6 g/l, no micro-cracks were observed on the modified Ti surfaces at current 0.1 A for short-pulse durations (≤50 μs). Moreover, the thickness of the recast layer increases with increasing current, pulse duration and concentration. Under the same working parameters, the thickness of recast layers on modified Ti enhances to approximately 4–11 μm in the concentration of 6 g/l Ti powder dielectric solvent. When Ti modified at different working parameters in deionized water mixed with Ti powder dielectric solvent, the TiO phase was observed within the recast layers. It was found that the modified Ti at current 0.1 A for 30 μs and 50 μs in a 6 g/l concentration of Ti powder dielectric solvent generates a hydrophilicity surface. Therefore, adding a suitable concentration of Ti powder into the dielectric solvent not only prevent the formation of surface cracks and micro-cracks, but also raise the wettability on the surfaces of Ti during MC-EDM modifications. |
Databáze: | OpenAIRE |
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