Integrated Infrared Failure Analysis of Printed Circuit Boards

Autor:	J. Miles, J. Kliman, C. R. Zelak, J. E. Sunderland
Rok vydání:	1995
Předmět:	Engineering Printed circuit board Mechanics of Materials Infrared business.industry Electrical engineering Electrical and Electronic Engineering Diagnostic board Tape-out business Computer Science Applications Electronic Optical and Magnetic Materials
Zdroj:	Journal of Electronic Packaging. 117:288-293
ISSN:	1528-9044 1043-7398
DOI:	10.1115/1.2792107
Popis:	A method is presented to test automatically for latent faults, those which elude detection during conventional electronic testing, on printed circuit boards. Testing is intended for implementation in a volume manufacturing environment and involves the application of infrared imaging tools. Successful incorporation of infrared testing into existing test processes requires that: a procedure for handling variable radiation heat transfer properties across a printed circuit board be developed; a thermally-controlled test enclosure be provided; PASS/FAIL criteria be established. These tasks are addressed, testing procedures are described, and favorable results are presented. The feasibility of an infrared test process is demonstrated.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::05ef9d5ab464ab888c168c6d6cba8395 https://doi.org/10.1115/1.2792107 Zobrazit plný text záznamu