Silicon-on-Insulator Substrates as a Micromachining Platform for Advanced Terahertz Circuits
| Autor: | Matthew F. Bauwens, N. Scott Barker, Arthur Lichtenb erger, Robert M. Weikle |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
Materials science
business.industry Hybrid silicon laser Terahertz radiation Bolometer Silicon on insulator Hardware_PERFORMANCEANDRELIABILITY law.invention Surface micromachining law Hardware_INTEGRATEDCIRCUITS Power dividers and directional couplers Optoelectronics Electronics Electrical and Electronic Engineering business Electronic circuit |
| Zdroj: | Proceedings of the IEEE. 105:1105-1120 |
| ISSN: | 1558-2256 0018-9219 |
| DOI: | 10.1109/jproc.2016.2612191 |
| Popis: | This paper presents a comprehensive overview of the development and utilization of a micromachined silicon-on-insulator (SOI) fabrication process that has enabled the development of terahertz (THz) frequency superconducting-insulator-superconducting (SIS) and hot-electron bolometer (HEB) mixers, broadband directional couplers, on-wafer probes, as well as several multipliers. Through the detailed presentation of these circuits, it is demonstrated that ultrathin silicon is able to provide the required characteristics to enable the heterogeneous integration of multiple device technologies that is likely to be required for future THz system-on-chip (T-SoC) development. |
| Databáze: | OpenAIRE |
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