Polyimide/Cr/Cu in the presence of chloride ions
| Autor: | J. Spalik, B. Rands, J. Baldwin, A. D. Katnani |
|---|---|
| Rok vydání: | 1990 |
| Předmět: |
Auger electron spectroscopy
Materials science Scanning electron microscope Analytical chemistry chemistry.chemical_element Surfaces and Interfaces Dielectric Condensed Matter Physics Chloride Copper Surfaces Coatings and Films Ion Metal chemistry visual_art medicine visual_art.visual_art_medium Polyimide medicine.drug |
| Zdroj: | Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 8:2363-2365 |
| ISSN: | 1520-8559 0734-2101 |
| DOI: | 10.1116/1.576698 |
| Popis: | Chloride residues, elevated temperature, and humidity affect circuit line adhesion to dielectric material in electronic packaging. Effects of the above parameters on the polyimide (PI)/metal interface are discussed. Scrupulously cleaned, and HCl doped circuitized parts were exposed to elevated temperature and humidity for 250 h. The interface was investigated with scanning electron microscopy (SEM) and Auger electron spectroscopy (AES). SEM results showed that peeled circuit lines exhibit three types of interfacial separation. Areas near the edges exhibited Cr–Cu separation, regions in the center of the line exhibited cohesive separation in the PI, and randomly distributed islands exhibited Cu–Cu separation. Chloride ions promoted interfacial degradation, which propagated perpendicular to the edge of the circuit line. Furthermore, AES results revealed that the depth of the cohesive failure within the PI decreased as the chloride ion concentration increased. This result is attributed either to mechanical f... |
| Databáze: | OpenAIRE |
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