Tri-layer nanoindentation for mechanical characterization of ultra-low-k dielectrics
Autor: | Yingjie Du, Thomas M. Shaw, Xiao Hu Liu, Tingge Xu, Griselda Bonilla, Hongbing Lu |
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Rok vydání: | 2017 |
Předmět: |
Materials science
02 engineering and technology Dielectric Nanoindentation 021001 nanoscience & nanotechnology Finite element method Tetraethyl orthosilicate Stress (mechanics) chemistry.chemical_compound 020303 mechanical engineering & transports 0203 mechanical engineering chemistry Forensic engineering Nanoindenter Thin film Composite material 0210 nano-technology Layer (electronics) |
Zdroj: | 2017 IEEE International Interconnect Technology Conference (IITC). |
Popis: | Recently the mechanical properties of nano-porous ultra-low-k (ULK) dielectric thin films have been characterized by nanoindentation using a tri-layer sample configuration. Tetraethyl orthosilicate (TEOS) silica was coated on the fragile ULK thin film to protect it from direct contact with nanoindenter tip. In this paper, the finite element method (FEM) simulations are conducted to investigate the effect of TEOS thickness, and to propose rules to design the tri-layer sample. |
Databáze: | OpenAIRE |
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