Machine learning Assists on High Aspect Ratio Slit Trench Etching in 3D NAND

Autor:	Yu-Fan Chang, Hong-Ji Lee, Fu-Hsing Chou, Shih-Chin Lee, Yao-An Chung, Nan-Tzu Lian, Tzung-Ting Han, Tahone Yang, Kuang-Chao Chen, Chih-Yuan Lu
Rok vydání:	2022
Zdroj:	2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::0504bb9117baa96baf341f03031ad3ca https://doi.org/10.1109/asmc54647.2022.9792507 Zobrazit plný text záznamu