| Popis: |
Light emitting devices (LEDs) are widely used in the liquid crystal display (LCD) industry, especially for LCD back light units. Therefore, much research has been performed to minimize manufacturing costs. However, the current process does not process LED chips from broken substrates even though the substrate is expensive sapphire wafer. This is because the broken substrates lose their alignment marks. After pre-processing, LED dies are glued onto blue tape to continue post-processing. If auxiliary alignment marks are stamped on the blue tape, post-processing can be performed using some of the LED dies from broken substrates. In this paper, a novel stamper module that can stamp the alignment mark on the blue tape is proposed, designed, and fabricated. In testing, the stamper was reliable even after a few hundred stamps. The module can position the stamp and apply the pattern effectively. By using this module, the LED industry can reduce manufacturing costs. |
