Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips
| Autor: | D.C. Sekar, C.R. King, Muhannad S. Bakir, James D. Meindl, B. Dang |
|---|---|
| Rok vydání: | 2010 |
| Předmět: |
Microchannel
Materials science Computer cooling business.industry Thermal resistance Electrical engineering Hardware_PERFORMANCEANDRELIABILITY Integrated circuit Heat sink Chip law.invention Hardware_GENERAL law Hardware_INTEGRATEDCIRCUITS Water cooling Optoelectronics Electrical and Electronic Engineering business Wafer-level packaging |
| Zdroj: | IEEE Transactions on Advanced Packaging. 33:79-87 |
| ISSN: | 1557-9980 1521-3323 |
| DOI: | 10.1109/tadvp.2009.2035999 |
| Popis: | Power dissipation in microprocessors is projected to reach a level that may necessitate chip-level liquid cooling in the near future. An on-chip microchannel heat sink can reduce the total thermal interfaces between an integrated circuit chip and the convective cooling medium and therefore yield smaller junction-to-ambient thermal resistance. This paper reports the fabrication, assembly, and testing of a silicon chip with complementary metal-oxide-semiconductor process compatible microchannel heat sink and thermofluidic chip input/output (I/O) interconnects fabricated using wafer-level batch processing. Ultra-small form factor, low-cost fabrication and assembly (system integration) are achieved for 2D and 3D chips, as the microchannel heat sink is fabricated directly on back-side of each chip. Through-wafer electrical and fluidic vias are used to interconnect the monolithically integrated microchannel heat sink to thermofluidic chip I/O interconnections. The feasibility of the novel fluidic I/O interconnect is demonstrated through preliminary thermal resistance measurements. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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