Experimental and modelling thermal study of a 3D-stacked silicon based LEDs array concept
| Autor: | Adrien Gasse, Aurelie Vandeneynde, Frederic Mercier, N. Ait-Mani, Bertrand Chambion, Pamela Rueda, A. Gueugnot, David Henry, Boris Bouillard |
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| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Interconnection Computer science Thermal resistance 020208 electrical & electronic engineering High voltage 02 engineering and technology 01 natural sciences law.invention Thermal conductivity law 0103 physical sciences Thermal Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Electronic engineering Power semiconductor device Flip chip Light-emitting diode |
| Zdroj: | 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). |
| DOI: | 10.1109/therminic.2017.8233843 |
| Popis: | This work deals with an overall concept of a 3D-stack enabling to produce a directly pluggable high voltage power LED. Using a dedicated silicon vehicle test, a thermal study is carried out with an extensive thermal modelling, optimization, assembly process and Infrared thermal characterization. It is shown that the main thermal issues are due to the presence of the flip chip interconnection layer and in particular the interconnect bump distribution leading to hot spots localization when bumps are missing. According to the results and with a two-steps modelling approach, we can conclude on the good model accuracy (within 11% for the worst cases). Consequently, its relevance for further generation of 3D stacked power devices design highlights the packaging strategy importance to target high performance devices. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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