Interface singular field analysis and thermal fatigue failure of solder joint in a stacked electronic modules
| Autor: | Zhong-ying Han, Xiao-guang Huang |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Materials science Field (physics) 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Atomic and Molecular Physics and Optics Viscoelasticity Electronic Optical and Magnetic Materials Power (physics) Cracking Creep Soldering 0103 physical sciences Forensic engineering Electrical and Electronic Engineering Deformation (engineering) Composite material 0210 nano-technology Joint (geology) |
| Zdroj: | Journal of Materials Science: Materials in Electronics. 27:8299-8311 |
| ISSN: | 1573-482X 0957-4522 |
| DOI: | 10.1007/s10854-016-4838-1 |
| Popis: | Thermal fatigue failure of an electronic package usually initiates from the interface of solder joints for the mismatch deformation. Because of the viscoelastic creep properties of the solder, the interfacial stress–strain are intrinsically time dependent. The constitutive relationship of two solder materials, Sn–3Ag–0.5Cu and Pb–5Sn are established by creep test. The thermal-structural analysis of the whole stacked chipset during power on/off cycles are conducted. The time dependent stress–strain singular field at the solder–substance interface are obtained by sub-model technique and the singular field parameters are quantitatively evaluated. Furthermore, the thermal fatigue cracking is experimentally measured, and the singular stresses and strains at the interface are discussed with respect to thermal fatigue failure. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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