| Autor: |
K-W Lee, J-C Bea, Takafumi Fukushima, Tetsu Tanaka, C. Nagai, Mitsumasa Koyanagi, R. Suresh, Xin Wu |
| Rok vydání: |
2015 |
| Předmět: |
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| Zdroj: |
2015 IEEE International Electron Devices Meeting (IEDM). |
| Popis: |
In order to solve the critical issues of current standard chip-to-wafer (C2W)/wafer-to-wafer (W2W) hybrid bonding technologies, we propose novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using three types of scaled tiny electrodes with slightly extruded structure and unique adhesive layers for ultra-high density 2.5D/3D integration applications. Especially, we developed a high stacking yield hybrid bonding technology using unique anisotropic conductive film composed of ultra-high density nano-Cu filaments for exascale 2.5D/3D integration. Multi numbers of TEG die with 7mm × 23mm size are simultaneously aligned with high accuracy around 1um by chip self-assembly method and thermal-compression bonding in wafer-level. Totally 3,898,000 of 4,309,200 electrodes with 3um diameter/6um pitch in each TEG chip are well intact-bonded by new hybrid bonding technology using ultra-high density nano-Cu filaments which gives rise to the joining yield of 90%. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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