Effective and reliable heat management for power devices exposed to cyclic short overload pulses
| Autor: | Werner Robl, Sven Gustav Lanzerstorfer, Stefan Decker, Markus Ladurner, Thomas Detzel, Stefan Wöhlert, Bernhard Auer, Michael Rogalli, Robert Illing, Michael Nelhiebel, J. Fugger |
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| Rok vydání: | 2013 |
| Předmět: |
Engineering
business.industry Automotive industry Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Power (physics) Reliability (semiconductor) Hardware_INTEGRATEDCIRCUITS Electronic engineering Power semiconductor device Electrical and Electronic Engineering Safety Risk Reliability and Quality business Heat management |
| Zdroj: | Microelectronics Reliability. 53:1745-1749 |
| ISSN: | 0026-2714 |
| Popis: | Electric overload situations in automotive truck applications necessitate a particularly efficient and reliable heat management for silicon power devices, especially when repetitive events must be handled. We show by simulations and experiments that a thick copper power metallization is particularly useful for overload pulses in the 10 μs range, and demonstrate the reliability of this solution. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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