A Highly Reliable Structure for Power-Semiconductor Devices That a Nano-spring Layer Absorbs Thermal Deformation

Autor:	Takayuki Kitamura, Takashi Sumigawa, Hisashi Tanie
Rok vydání:	2016
Předmět:	Materials science Nano Thermal deformation Semiconductor device Spring (mathematics) Composite material Layer (electronics) Power (physics)
Zdroj:	Journal of Smart Processing. 5:251-258
ISSN:	2187-1337 2186-702X
DOI:	10.7791/jspmee.5.251
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::037f93a15c9027b770a34cfb574bd065 https://doi.org/10.7791/jspmee.5.251 Zobrazit plný text záznamu