High Resolution Optical Interference Measurements of Changes in Bond-Line Thickness—A Review

Autor: D. A. Tossell, K. H. G. Ashbee, J. P. Sargent
Rok vydání: 1990
Předmět:
Zdroj: The Journal of Adhesion. 31:103-116
ISSN: 1545-5823
0021-8464
DOI: 10.1080/00218469008048219
Popis: A novel moire optical interference method, originally developed1 to measure the swelling displacement normal to the plane of a simple butt joint during water uptake at the joint edge, was subsequently used to investigate the unexpected occurrence of shrinkage and, at the same time, swelling during exposure to organic solvents. In later experiments, synergistic displacement fields generated during simultaneous exposure to water and organic solvents were studied. The same method has also been used to investigate the origin of adhesion failures at copper plated-through holes in thermally cycled multi-layer circuit boards. The method employs a thin glass cover slip as one adherend. Changes in bondline thickness flex the cover slip thereby changing the gap between the latter and a nearby optical flat. By using monochromatic light to illuminate the specimen, interference between incident and reflected light is achieved. The small displacements of individual fringes associated with changes in gap size a...
Databáze: OpenAIRE