Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites
| Autor: | Jing He, Qiqi Qu, Yunsheng Da, Hua Wang, Zheng Su, Tengfei Qin, Xingyou Tian |
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| Rok vydání: | 2020 |
| Předmět: |
Materials science
Polymers and Plastics Oxide Electronic packaging 02 engineering and technology 010402 general chemistry 01 natural sciences law.invention chemistry.chemical_compound Thermal conductivity Electrical resistivity and conductivity law Materials Chemistry Silicon carbide Composite material Graphene Epoxy 021001 nanoscience & nanotechnology Thermal conduction 0104 chemical sciences chemistry Mechanics of Materials visual_art Ceramics and Composites visual_art.visual_art_medium 0210 nano-technology |
| Zdroj: | Composites Communications. 22:100448 |
| ISSN: | 2452-2139 |
| DOI: | 10.1016/j.coco.2020.100448 |
| Popis: | Graphene oxide (GO) has been widely used in modern electronic packaging materials because of its excellent performance. Nevertheless, inherently electrical conductivity and hygroscopicity of GO would greatly reduce the reliability of polymer composites as electronic packaging materials. In this work, different ratio GO and functionalized silicon carbide (SiC) particles formed an effective thermal conduction path through electrostatic self-assembly in epoxy resin (ER). SiC particles also played a critical role in enhancing the reliability of epoxy composites due to hydrophobicity and poor electrical properties. The obtained composites, at the optimal ratio of GO and SiC particles of 1:100, exhibited a high thermal conductivity (0.91 W/(mK)). The composites also presented that the thermal conductivity and electrical insulating were not destroyed after 40 h of wet-heat treatment. This strategy provided an insight into the design of high-performance composites with the potential to be used in advanced electronic packaging. |
| Databáze: | OpenAIRE |
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