Advanced DBC - Highly Reliable and Conductive Copper Ceramic Substrates
| Autor: | Jessica Reitz, Ilias Nikolaidis, Anton Miric, Melanie Bawohl, Gabriel Zier, Mark Challingsworth, Kai Herbst, Christina Modes, Paul Gundel |
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| Rok vydání: | 2016 |
| Předmět: |
Materials science
business.industry chemistry.chemical_element dBc Temperature cycling Conductivity Copper Reliability (semiconductor) Thermal conductivity chemistry visual_art Electronic engineering visual_art.visual_art_medium Optoelectronics Pharmacology (medical) Ceramic business Electrical conductor |
| Zdroj: | Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000073-000078 |
| ISSN: | 2380-4491 |
| DOI: | 10.4071/2016cicmt-tp2b2 |
| Popis: | So far Direct Bonded Copper (DBC) substrates have been the standard for power electronics. They provide excellent electrical and thermal conductivity at low cost. Weaknesses of DBC technology are the inevitable warpage and the relatively low reliability under thermal cycling. The low reliability poses a significant hurdle in particular for automotive applications with high lifetime requirements. Thick Print Copper (TPC) substrates with low warpage and excellent reliability overcome these weaknesses, but also provide a reduced conductivity at a higher cost. We present two thick-film/DBC hybrid technologies which combine the best properties of DBC and TPC: excellent conductivity, low cost, reduced warpage and excellent reliability. |
| Databáze: | OpenAIRE |
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