Automotive semiconductor test
| Autor: | Ting-Pu Tai, Steve Pateras |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
Engineering
business.industry media_common.quotation_subject Automotive industry 02 engineering and technology Automatic test pattern generation Automotive electronics Field (computer science) 020202 computer hardware & architecture Reliability engineering Reliability (semiconductor) Built-in self-test 0202 electrical engineering electronic engineering information engineering Key (cryptography) Quality (business) business media_common |
| Zdroj: | VLSI-DAT |
| DOI: | 10.1109/vlsi-dat.2017.7939655 |
| Popis: | Meeting the quality and reliability requirements of the ISO 26262 and other automotive electronics standards will only become more difficult as device sizes and complexities continue to grow. New advanced test technologies such as cell-aware ATPG, hybrid compression / logic BIST / memory BIST and diagnosis-driven yield analysis with RCD provide some key building blocks towards ensuring compliance to the new standards. Adoption of these and other advanced test capabilities will not only improve the ability of semiconductor manufacturers to achieve necessary quality and reliability metrics, but will also help to further differentiate their products by delivering embedded test capabilities that can be leveraged by their customers at the system level and in the field. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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