| Autor: |
David Borowsky, Ingo Herrmann, Christoph Schelling, Shen Hue Sun, Daniel B. Etter, Franz Xaver Hutter, Joachim N. Burghartz, Fabian Utermohlen |
| Rok vydání: |
2014 |
| Předmět: |
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| Zdroj: |
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS). |
| Popis: |
We present a scalable low-cost microbolometer technology platform which is based on separate fabrication of MEMS and read-out ASIC CMOS wafers. Mechanical, electrical and hermetical connection is achieved by Cu-based thermocompression bonding. The performance loss due to the resulting backside illumination of the sensor is compensated by an optimized microbolometer design including nano-scaled plasmonic absorbers, a dedicated pixel geometry and the use of highly temperature sensitive devices. The low-cost approach features CMOS compatible MEMS processes, wafer level packaging and uncooled operation of the sensor. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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