Mechanism of Cobalt Bottom-Up Filling for Advanced Node Interconnect Metallization
| Autor: | S. Branagan, Fred Wafula, H. Suzuki, J. van Eisden, Jun Wu |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Interconnection
Materials science Renewable Energy Sustainability and the Environment 020209 energy Node (networking) chemistry.chemical_element 02 engineering and technology Condensed Matter Physics Topology Surfaces Coatings and Films Electronic Optical and Magnetic Materials Mechanism (engineering) chemistry 0202 electrical engineering electronic engineering information engineering Materials Chemistry Electrochemistry Cobalt |
| Zdroj: | Journal of The Electrochemical Society. 166:D3136-D3141 |
| ISSN: | 1945-7111 0013-4651 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|