| Autor: |
Qin Lei Sun, Ai Hua Li, Xiao Gang Han, Mei Quan Liu |
| Rok vydání: |
2013 |
| Předmět: |
|
| Zdroj: |
2013 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices. |
| DOI: |
10.1109/asemd.2013.6780820 |
| Popis: |
It's difficult to distinguish the echo superimposed signal between Thin layer interface up and down when measuring thickness by ultrasonic method. In order to solve this problem, ultrasonic signal processing methods is used to extract characterization of thickness, and the high-precision thickness of thin layer material is realized. This method overcomes the defects that can't separate superposition using traditional echo method. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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