Ultra-low-temperature lead-free multicomponent alloy solder for application in heat-sensitive electronic components

Autor:	R.E. Villarreal-Loya, C.G. Garay-Reyes, J.M. Mendoza-Duarte, J.L. Hernández-Rivera, J.J. Cruz-Rivera, I. Estrada-Guel, R. Martínez-Sánchez
Rok vydání:	2023
Předmět:	Mechanics of Materials Mechanical Engineering General Materials Science Condensed Matter Physics
Zdroj:	Materials Letters. 343:134342
ISSN:	0167-577X
DOI:	10.1016/j.matlet.2023.134342
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::020ece0a38f2d9647438d5d267f72182 https://doi.org/10.1016/j.matlet.2023.134342 Zobrazit plný text záznamu Full Text from ScienceDirect