Nanowire Impregnated Poly-dimethyl Siloxane for Flexible, Thermally Conductive Fan-Out Wafer-Level Packaging
| Autor: | Samatha Benedict, Yuan Hu, Subramanian S. Iyer, Arsalan Alam, Timothy S. Fisher, Randall Irwin |
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| Rok vydání: | 2020 |
| Předmět: |
Materials science
02 engineering and technology Welding Molding (process) 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences Die (integrated circuit) 0104 chemical sciences law.invention chemistry.chemical_compound Thermal conductivity chemistry law Soldering Siloxane Thermal stability Composite material 0210 nano-technology Wafer-level packaging |
| Zdroj: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). |
| Popis: | FlexTrateTM, a flexible hybrid electronics (FHE) platform based on fan-out wafer level packaging (FOWLP) has demonstrated low die shift by using room temperature cured poly-dimethyl siloxane (PDMS) as a molding compound. In this paper, we investigate the enhancement of the thermal conductivity in PDMS used in the FlexTrateTM process to allow for better thermal management via microwave welding of commercially available copper nanowires dispersed in an uncured PDMS matrix, followed by a standard curing process. We also evaluate the thermal stability of PDMS, necessary if FlexTrateTM assemblies are to be used in conjunction with commonly used solder reflow processes, and show that PDMS is stable at standard reflow temperatures. Thermal conductivity enhancement using the microwave welding process is shown to be minimal, with a peak enhancement of ~40%. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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