Dual Referencing Simulation Approach on High Speed Interconnects USB3.2 (10Gbps)

Autor:	Li Wern Chew, Paik Wen Ong
Rok vydání:	2022
Zdroj:	2022 International Conference on Electronics Packaging (ICEP).
DOI:	10.23919/icep55381.2022.9795442
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::013c6d0cba872a8d68f44be1a04d2983 https://doi.org/10.23919/icep55381.2022.9795442 Zobrazit plný text záznamu