Predicting substrate-induced focus error
| Autor: | Stephen E. Greco, Timothy A. Brunner, Kourosh Nafisi, Ian Stobert, Bernhard R. Liegl, Nelson Felix, Chandrasekhar Sarma, Brian C. Sapp |
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| Rok vydání: | 2010 |
| Předmět: |
Focus (computing)
Computer science business.industry Mechanical Engineering Flatness (systems theory) Process (computing) Mechanical engineering ComputerApplications_COMPUTERSINOTHERSYSTEMS Hardware_PERFORMANCEANDRELIABILITY Edge (geometry) Condensed Matter Physics Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials Process variation Optics Hardware_INTEGRATEDCIRCUITS Wafer Process window Electrical and Electronic Engineering business Lithography |
| Zdroj: | Journal of Micro/Nanolithography, MEMS, and MOEMS. 9:041311 |
| ISSN: | 1932-5150 |
| Popis: | The ever-shrinking lithography process window dictates that we maximize our process window, minimize process variation, and quantify the disturbances to an imaging process caused upstream of the imaging step. Relevant factors include across-wafer and wafer-to-wafer film thickness variation, wafer flatness, wafer edge effects, and design-induced topography. We present our effort to predict design-induced focus error hot spots based on prior knowledge of the wafer surface topography. This knowledge of wafer areas challenging the edge of our process window enables a constructive discussion with our design and integration team to prevent or mitigate focus error hot spots upstream of the imaging process. |
| Databáze: | OpenAIRE |
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