| Autor: |
Bidyut Sen, Kevin Cai, Qian Gao |
| Rok vydání: |
2020 |
| Předmět: |
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| Zdroj: |
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI). |
| DOI: |
10.1109/emcsi38923.2020.9191481 |
| Popis: |
Accurate characterization for component and PCB materials is essential for effective high-speed system designs. The differential pairs are often used as testing fixtures to characterize the component. The time delay skew observed on the testing fixture can cause false results in system and component simulations. Therefore, the removal of the skew of the differential pair is critical. This paper presents a set of four skew removal approaches. To demonstrate its validity, this paper used actual VNA measurement data of differential pairs with different lengths to exhibit the de-skewing process, targeted at the intra-pair skew caused by PCB fiber weaving effects. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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