Impact of Vertical Electropolishing with Flipping System on Removal Uniformity and Surface State: Study with 9-Cell Niobium Coupon Cavity
| Autor: | Nii, Keisuke, Chouhan, Vijay, Hayano, Hitoshi, Ida, Yoshiaki, Kato, Shigeki, Monjushiro, Hideaki, Saeki, Takayuki, Yamaguchi, Takanori |
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| Jazyk: | angličtina |
| Rok vydání: | 2022 |
| Předmět: | |
| DOI: | 10.18429/jacow-srf2021-thpcav003 |
| Popis: | We have been developing a vertical electropolishing (VEP) method for niobium superconducting RF cavities using a novel setup that allows periodic flipping of the cavity to put it upside down in the VEP process. The purpose of using the novel setup named as flipping system is to achieve uniform removal and smooth surface of the cavity. Previously, we have already introduced the VEP system and showed the preliminary results of VEP performed with the flipping system. In this article, we report VEP results obtained with a nine-cell coupon cavity. The results include detail on coupon currents with I-V curves for coupons, and impact of the cavity flipping on removal uniformity and surface morphology of the cavity. Proceedings of the 20th International Conference on RF Superconductivity, SRF2021, East Lansing, MI, USA |
| Databáze: | OpenAIRE |
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