Modal Wavelets Analysis of the Infrared Electronic Circuit Boards Images
Autor: | Kiyoshi Horii, Yoshifuru Saito, Yu Usuda, Seiji Hayano |
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Rok vydání: | 2005 |
Předmět: | |
Zdroj: | Journal of the Visualization Society of Japan. 25:157-160 |
ISSN: | 1884-037X 0916-4731 |
DOI: | 10.3154/jvs.25.supplement1_157 |
Popis: | Modern microelectronics has made it possible to work out a lot of many small electronics, such as electronic calculator, radio, notebook computer and so on. As a result, electronics circuits have become small integrated circuits. This means that precise micron level inspecting technique should be exploited to produce the highly reliable electronics products.In this paper, we apply the thermal infrared dynamic image method to the electronic circuit boards inspection. Our infrared dynamic image method plans to work out the extraction of fault parts from dynamic infrared image by applying modal wavelets transform. As a first step of this project, this paper demonstrates the usefulness of dynamic infrared image method to the nondestructive inspection of electronic printed circuit boards. |
Databáze: | OpenAIRE |
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