Electrochemical deposition and characterization of Copper Pillar Bumps — Application towards Flip chip bonding

Autor:	Sampada Sameer Naik, Harsha Sanjeev, Megha Agrawal, Mahalakshmi S
Rok vydání:	2020
Zdroj:	2020 5th IEEE International Conference on Emerging Electronics (ICEE).
DOI:	10.1109/icee50728.2020.9777005
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::00342fa148ea2b1be3a227994c3dfaf5 https://doi.org/10.1109/icee50728.2020.9777005 Zobrazit plný text záznamu