| Popis: |
A material wherein abrasive grains are bonded together by a bonding material is known as a whetstone. The whetstone comprises abrasive grains, a bonding material, and pores. The abrasive grains play the role of a cutting edge, the bonding material fixes and supports the grains, and the pores act as a chip pocket to help discharge of cutting chips. In whetstones where the bonding material is a resinoid bond or metal bond, there are not normally any pores. The process whereby a grinding wheel which is a circular whetstone is rotated, and the surface of a workpiece is gradually ground down by the abrasive grains on the grinding wheel, is referred to as grinding. Grinding can produce very high shape accuracy and dimensional precision even with hard workpieces like ceramics, or permit a surface with a satisfactory roughness to be obtained, and is therefore an extremely important processing technique. |
