Analysis of a solidification interface stability Al - Cu by the heat balance integral method

Autor:	B. Magiera, A, Micker
Jazyk:	angličtina
Rok vydání:	2010
Předmět:	Condensed Matter::Soft Condensed Matter Physics::Fluid Dynamics Condensed Matter::Materials Science Stopy Al-Cu Program Mathcad lcsh:TA401-492 Analizy stabilności powierzchni krzepnięcia lcsh:Materials of engineering and construction. Mechanics of materials
Zdroj:	Archives of Foundry Engineering, Vol 10, Iss SI 4, Pp 49-54 (2010)
ISSN:	1897-3310
Popis:	The aim of his thesis is the analysis of a planar interface solidification stability of alloys. The stability of a planar interface solidification is tested by means of solving the heat conduction equation for solids and liquid and a mass diffusion equation for liquid, under assumed boundary, initial and continuity conditions. The solidification equations are solved using the method of heat balance integral and the theorem of the derivative integrals, whose limitsdepend on the parameter.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doajarticles::b3b1b828315488f6c69a9b3ef37b3953 http://www.afe.polsl.pl/index.php/pl/2677/analysis-of-a-solidification-interface-stability-al-cu-by-the-heat-balance-integral-method.pdf Zobrazit plný text záznamu