What are the main roadblocks for future ULSI (devices, interconnects, power consumption, economic issues

Autor:	Schwierz J.J. Liou R. Chau S. Cristoloveanu C. Hu P.M. Zeizoff H. Iwai K. Yano J.W. Lee T. Skotnicki S. Selberherr, F.
Přispěvatelé:	Domenget, Chahla, Institut de Microélectronique, Electromagnétisme et Photonique (IMEP), Université Joseph Fourier - Grenoble 1 (UJF)-Institut National Polytechnique de Grenoble (INPG)-Centre National de la Recherche Scientifique (CNRS), Centre National de la Recherche Scientifique (CNRS)-Institut National Polytechnique de Grenoble (INPG)-Université Joseph Fourier - Grenoble 1 (UJF)
Jazyk:	angličtina
Rok vydání:	2006
Předmět:	[SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
Zdroj:	ICSICT'06 Panel Session, 8th Int. Conf. on Solid-State and Integrated Circuits Technology (ICSICT'06) ICSICT'06 Panel Session, 8th Int. Conf. on Solid-State and Integrated Circuits Technology (ICSICT'06), Shanghai, China
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::f2ad75d20b94039310d7a03b2e9db1b1 https://hal.archives-ouvertes.fr/hal-00145647