Modular robotic platform for silicon micromechanical assembly
| Autor: | Hériban, David, Gauthier, Michaël, Gendreau, Dominique |
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| Přispěvatelé: | Franche-Comté Électronique Mécanique, Thermique et Optique - Sciences et Technologies (UMR 6174) (FEMTO-ST), Université de Technologie de Belfort-Montbeliard (UTBM)-Ecole Nationale Supérieure de Mécanique et des Microtechniques (ENSMM)-Université de Franche-Comté (UFC), Université Bourgogne Franche-Comté [COMUE] (UBFC)-Université Bourgogne Franche-Comté [COMUE] (UBFC)-Centre National de la Recherche Scientifique (CNRS) |
| Jazyk: | angličtina |
| Rok vydání: | 2008 |
| Předmět: | |
| Zdroj: | 6th International Workshop on Microfactories, IWMF'08. 6th International Workshop on Microfactories, IWMF'08., Oct 2008, Evanston, Il., United States. pp.440-445 |
| Popis: | International audience; As no reliable methods is available to manipulate component whose typical size is up to 100μm, current industrial assembled products contained only components down to this physical limit. In that scale, micro-assembly requires specific handling strategies to overcome adhesion and high precision robots. This paper deals with an original robotic system able to perform reliable micro-assembly of silicon microobjects whose sizes are tens of micrometers. Original hybrid handling strategies between gripping and adhesion handling are proposed. An experimental robotic structure composed of micropositionning stages, videomicroscopes, piezogripper, and silicon end-effectors is presented. A modular control architecture is proposed to easily design and modify the robotic structure. Some experimental teleoperated micromanipulations and micro-assemblies have validated the proposed methods and the reliability of the principles. Future works will be focused on micro-assembly automation. |
| Databáze: | OpenAIRE |
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