| Autor: |
Westerveld, W.J., Leinders, S.M., Neer, P.L.M.J. van, Snyder, B., Urbach, H.P., Jong, N. de, Verweij, M.D., Rottenberg, X., Rochus, V. |
| Jazyk: |
angličtina |
| Rok vydání: |
2018 |
| Zdroj: |
IEEE Photonics Society Benelux Chapter Belgium 2018 |
| Popis: |
Future applications of ultrasonography in (bio-)medical imaging require ultrasound sensor matrices with small sensitive elements. Promising are opto-mechanical ultrasound sensors (OMUS) based on a silicon photonic ring resonator embedded in a silicondioxide acoustical membrane. This work presents new OMUS modelling: acoustomechanical non-linear FEM and photonic circuit equations. We show that initial wafer stress needs to be considered in the design: the acoustical resonance frequency changes considerably and OMUS sensitivity differs for up- or downwards buckled membranes. Simulated acoustical resonance frequency agrees well with measurements, assuming realistic SOI wafer stress. Measured sensitivity showed large device-to-device variation and simulations agree within this order of magnitude. We conclude that careful modeling of stress is necessary for the design of robust and sensitive sensors. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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