High-power test device for package thermal assessment and validation of thermal measuremetn tecniques

Autor:	Jordà, Xavier, Perpiñà, Xavier, Vellvehi, Miquel, Madrid, Francesc, Altet Sanahujes, Josep
Přispěvatelé:	Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica, Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions
Jazyk:	angličtina
Rok vydání:	2010
Předmět:	Thermal test chips Electrònica Hardware_INTEGRATEDCIRCUITS Enginyeria electrònica [Àrees temàtiques de la UPC] Hardware_PERFORMANCEANDRELIABILITY Electronics Resistance temperature detector
Zdroj:	UPCommons. Portal del coneixement obert de la UPC Universitat Politècnica de Catalunya (UPC) Recercat. Dipósit de la Recerca de Catalunya instname
Popis:	This paper describes the structure and thermal behavior of a high-power thermal test chip (up to 200 W/cm2) designed for power electronics package assessment, which has also been used for the validation of thermal measurement techniques. In particular, we show two application examples where the proposed device allowed the assessment of different power substrate technologies, and the validation of temperature measurement techniques used to characterize the high frequency behavior of circuits and devices in the frequency domain using the heterodyne technique.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::77193d3be01642edd2440efd2ab4707f http://hdl.handle.net/2117/10519 Zobrazit plný text záznamu