Bend fatigue reliability test and analysis for Pb-free solder joint

Autor:	Che, F. -X, Pang, H. L. J., Desmond Y.R. Chong, Low, P. T. H.
Zdroj:	Scopus-Elsevier
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::1da711c328c19d8838c2262a67bfb113 http://www.scopus.com/inward/record.url?eid=2-s2.0-33845563852&partnerID=MN8TOARS Zobrazit plný text záznamu