Thermal characterisation as a part of reliability testing of THz schottky diodes
| Autor: | Kiuru, Tero, Khanal, Subash, Mallat, Juha, Räisänen, Antti V., Närhi, Tapani |
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| Přispěvatelé: | Sihvola, Ari H., Wallén, Henrik |
| Jazyk: | angličtina |
| Rok vydání: | 2013 |
| Zdroj: | Kiuru, T, Khanal, S, Mallat, J, Räisänen, A V & Närhi, T 2013, Thermal characterisation as a part of reliability testing of THz schottky diodes . in A H Sihvola & H Wallén (eds), XXXIII URSI Convention on Radio Science and SMARAD Seminar 2013 . Aalto University, Espoo, Aalto University Publication Series Science + Technology, no. 8/2013, pp. 121-123, XXXIII URSI Convention on Radio Science, Espoo, Finland, 24/04/13 . < http://www.ursi.fi/2013/data/uploads/b3-1.pdf > |
| Popis: | This paper presents the most common thermal characterisation methods for semiconductor diodes and discusses why thermal characterisation is important for the diode reliability assessment. A special case of thermal characterisation of THz frequency Schottky diodes for MetOp Second Generation (MetOp-SG) satellite program instruments is covered in more detail. The benefits of accurate thermal characterisation in this case are explained and the drawbacks of unknown self-heating are discussed |
| Databáze: | OpenAIRE |
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