Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging

Autor: Tummala, Rao R., Raj, P. Markondeya, Atmur, Steve, Bansal, Shubhra, Banerji, Sounak, Liu, Fuhan, Bhattacharya, Swapan, Sundaram, Venky, Shinotani, Ken-ichi, White, George
Zdroj: Journal of Electroceramics; July 2004, Vol. 13 Issue: 1-3 p417-422, 6p
Abstrakt: Abstract The system-on-a-package (SOP) paradigm proposes a package level integration of digital, RF/analog and opto-electronic functions to address future convergent microsystems. Two major components of SOP fabrication are sequential build-up of multiple layers (4–8) of conducting copper patterns with interlayer dielectrics on a board and multiple ICs flip-chip bonded on the top layer. A wide range of passives, wave-guides and other RF and opto-electronic components buried within the dielectric layers provide the multiple functions on a single microminiaturized platform.
Databáze: Supplemental Index
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