| Autor: |
Venkataramana, P., Kumar, Perumalla Vijaya, Balakrishna, B. |
| Zdroj: |
Journal of the Institution of Engineers (India): Series C; 20240101, Issue: Preprints p1-13, 13p |
| Abstrakt: |
Recently, there has been significant advancement in numerous applications for electronics for the needs of consumers. The equipment uses microelectronic components exposed to a tremendous amount of power, subsequent in heat generation. Faster heat storage and disposal have been needed in such devices. In the present study, for the thermal performance of a pulsating heat pipe (PHP), copper oxide (CuO) and aluminium oxide (Al2O3) with deionized (DI) water are used as working fluids with different weight concentrations of 0.02 to 0.1 wt%. The experimental and numerical analyses are carried out on a PHP made of brass having an inner diameter (ID) of 2 mm and an outer diameter (OD) of 4 mm. The nanofluids are synthesized by a two-step process involving varying fill ratios. The heat input is applied to the evaporator section with the help of an electrical heater ranging from 0 to 100 watts. The condenser section was cooled by circulating cooling water around it. The average evaporator temperature and thermal resistance of LPHP were evaluated. The determination of the thermal conductivity (K) and viscosity of the nanofluids was conducted. The outcomes showed that CuO and Al2O3nanofluids had 46% less thermal resistance than deionized water, followed by Al2O3nanofluids at 70 W and a 60% fill ratio. Al2O3nanofluids have better thermal conductivity and viscosity than CuO nanofluids. The higher viscosity of Al2O3nanofluid would hamper fluid flow in PHP, increasing thermal resistance. The variations in mean evaporator temperature between CuO nanofluids and DI water were minor at low heating power. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
|
Full text from SpringerLink