Effect of pad size on shear strength and microstructure of LED solder joints
| Autor: | Shimizu, Koichi, Ma, Yufei, Jiang, Zihao, Wang, Subin, Hong, Ronghui, Xu, Yingchao, Zhu, Weiping, Liu, Bo, Liu, Zhifang |
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| Zdroj: | Proceedings of SPIE; October 2024, Vol. 13260 Issue: 1 p132600T-132600T-6, 1193407p |
| Databáze: | Supplemental Index |
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