| Autor: |
Jadhav, Jitendra J., Chaubey, V. K., Chandrashekhar |
| Zdroj: |
Transactions of Indian National Academy of Engineering; 20240101, Issue: Preprints p1-13, 13p |
| Abstrakt: |
Current avionics system operates under multifunctional modules designed through integration of highly complex subsystems comprising of sensor boards, Digital Signal Processing (DSP) modules, Field Programmable Gate Array (FPGA) and Microprocessors. Contemporary avionics system induces severe complex combination of thermal and mechanical stresses to perturb the system integrators and interconnections leading to a system failure. The present paper addresses this challenge and proposes analysis driven mechanism to detect the failure of critical components, Printed Circuit Boards (PCBs) and system to arrive at Remaining Useful Life (RUL) under the simulated harsh environment in an aircraft. The research to accurately predict the remaining useful life of the electronic board is being carried in a progressive mode by designing a new methodology of system modeling, simulation and experimentation of the electronic enclosure for temperature profiling and structural integrality has been characterized. The findings of the study establish a reliable prognosis approach to integrate physics-based models & data driven models to get more accurate prediction of failures. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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