Performance comparison of photosensitive polyimides for high-resolution dual-damascene schemes for FOWLP packaging applications

Autor: Guerrero, Douglas, Amblard, Gilles R., Bozano, Luisa, Quon, Roger, Briggs, Ben, Ley, Ryan, Pang, Athena, Suo, Peng, Lianto, Prayudi, Yong, Andy, Sundarrajan, Arvind, Fernandez, Jorge, Khasgiwale, Niranjan, Chuang, C. C., Chen, Jang Fung, Krishnan, Siddarth, Chudzik, Mike, Bencher, Chris
Zdroj: Proceedings of SPIE; April 2024, Vol. 12957 Issue: 1 p129570X-129570X-6, 1166137p
Databáze: Supplemental Index