Prediction of critical dimensions for 3D TSV structures using artificial neural network
| Autor: | Sendelbach, Matthew J., Schuch, Nivea G., Li, Jia-Wei, Su, Eugene, Ho, Chao-Ching |
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| Zdroj: | Proceedings of SPIE; April 2024, Vol. 12955 Issue: 1 p129552J-129552J-5, 1165974p |
| Databáze: | Supplemental Index |
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