Advanced EUV patterning of 2D TMDs for CMOS integration
| Autor: | Liddle, J. Alexander, Ruiz, Ricardo, Faramarzi, Vina, de Poortere, Etienne, Parayil Venugopalan, Syam, Woltgens, Pieter, Woo, Youngtag, van de Kerkhof, Mark, Kumar, Pawan, Medina Silva, Henry, Morin, Pierre, Asselberghs, Inge, Dorow, Chelsey, O'Brien, Kevin, Maxey, Kirby, Avci, Uygar |
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| Zdroj: | Proceedings of SPIE; April 2024, Vol. 12956 Issue: 1 p129560I-129560I-9, 1166050p |
| Databáze: | Supplemental Index |
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