Investigation of two-layer aluminum cold plate for high-power RF linear chip array cooling

Autor: Inoue, Atsushi, Wei, Tao, Ma, Yupu, Zhao, Jianfa, Zhang, Yusheng
Zdroj: Proceedings of SPIE; April 2024, Vol. 12987 Issue: 1 p129870M-129870M-7, 1168838p
Databáze: Supplemental Index