| Autor: |
Liang, Chia-Wei, Sung, Yu-Chi, Hwang, Sheng-Jye, Shih, Ming-Hsiang, Liao, Wen-Hsiang, Lin, Te-Hsun, Yang, Dong-Yan |
| Zdroj: |
Journal of Manufacturing Processes; June 2024, Vol. 119 Issue: 1 p649-665, 17p |
| Abstrakt: |
With the continuous advancement of IC packaging technology, 3D and 2.5D packaging systems have emerged as the prevailing trends. The advantages of large area and high I/O density have made fan-out panel-level packaging (FOPLP) been considered as one of the best package types for 3D and 2.5D packaging applications. The discussions about FOPLP have been popular recently. Warpage and reliability of FOPLP are the main concerns of packaging engineers. However, it was found that warpage and reliability of FOPLP are strongly related to the fabrication process but not many research works have been published. Thus, reliability analysis procedure considering the residual stress of fabrication process was proposed in this paper to observe warpage and stress distribution during fabrication process. Then, this research procedure facilitates subsequent fatigue life calculations and predicts reliability of the package. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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