Features of the occurrence of mechanical stresses in the semiconductor substrate when operating in thermal cycling mode
| Autor: | Sadullozoda, Shahriyor, Abdullozoda, Ramazona, Koryachko, Marina V., Pshonkin, Danila E., Skvortsov, Arkady A., Voloshinov, Evgeny B., Guskov, Andrey A. |
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| Zdroj: | Proceedings of SPIE; February 2024, Vol. 13065 Issue: 1 p130651D-130651D-6, 1175866p |
| Databáze: | Supplemental Index |
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