Microstructural and Tensile Behavior of a Thixoformed Al–Si–Cu–Mg Given T5 and T6 Heat Treatments Tested at Room and Elevated Temperatures

Autor: Aziz, A. M., Omar, M. Z., Samat, S., Mohamed, I. F., Sajuri, Z., Baghdadi, A. H.
Zdroj: International Journal of Metalcasting; July 2024, Vol. 18 Issue: 3 p2343-2356, 14p
Abstrakt: Developing a cost-effective, time-saving alternative technology for casting metal alloys is an industrial priority. Utilizing the forming technology called semisolid metal processing combined with heat treatment could enhance the mechanical properties of the selected alloy. Thus, the present work gives an insight into the microstructure evolution and mechanical properties of Al–Si–Cu–Mg alloy produced by the thixoforming process via cooling slope and subjected to T5 and T6 heat treatment routes. T5 and T6 heat-treated specimens were characterized with scanning electron microscope, X-ray diffraction (XRD), and energy-dispersive spectroscopy (EDS). In addition, tensile tests were conducted at room and elevated temperatures corresponding to 25 °C and 250 °C, respectively. The result indicated that heat-treated thixoformed sample exhibits microstructural refinement with uniformly distributed α-Al globules, fibrous Si particles and fragmented intermetallic compounds. However, morphological aspects of the silicon phase formed in thixoformed aluminium alloy with T6 heat treatment were fine and globular eutectic silicon compared to the T5 heat treatment. As a result, the ultimate tensile strength and yield strength of T6 heat-treated thixoformed specimens increased by 48% and 28%, with the resulting values being 312 MPa and 210 MPa, respectively, relative to those in T5 heat treatment alloys. In addition, both T5 and T6 heat-treated thixoformed specimens decreased yield strength and ultimate tensile with increasing temperature at 250 °C.
Databáze: Supplemental Index
Nepřihlášeným uživatelům se plný text nezobrazuje