High-density CD measurement technology with high throughput and high precision on the entire surface of a process wafer, capable of capturing randomly occurring CD defects
Autor: | Robinson, John C., Sendelbach, Matthew J., Fukazawa, Kazuhiko, Hirukawa, Shigeru, Miyazaki, Yosuke, Fujimori, Yoshihiko, Iwaki, Tomohiro, Okada, Tomonori |
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Zdroj: | Proceedings of SPIE; April 2023, Vol. 12496 Issue: 1 p1249611-1249611-12 |
Databáze: | Supplemental Index |
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