High-density CD measurement technology with high throughput and high precision on the entire surface of a process wafer, capable of capturing randomly occurring CD defects

Autor: Robinson, John C., Sendelbach, Matthew J., Fukazawa, Kazuhiko, Hirukawa, Shigeru, Miyazaki, Yosuke, Fujimori, Yoshihiko, Iwaki, Tomohiro, Okada, Tomonori
Zdroj: Proceedings of SPIE; April 2023, Vol. 12496 Issue: 1 p1249611-1249611-12
Databáze: Supplemental Index