| Autor: |
Song, Kay, Karim, Zia, Tan, Xinxuan, Bhat, Abhishek, Sautter, Kenneth, Mingardi, A, Vangoidsenhoven, D |
| Zdroj: |
ECS Transactions; May 2023, Vol. 111 Issue: 1 |
| Abstrakt: |
This paper reviews the low-temperature and low-pressure thermal polymerization of dielectric polyimides that are used for redistribution layers (RDLs). Specifically, this presentation illustrates the significant impact of the low-pressure cure process in reducing cure temperature (by 20° to 50°C) and cure times (by as much as 25%) while providing better imidization ratio, film stress, mechanical (elongation %, tensile strength, Young’s modulus), thermal (Tg, Td5%, CTE), and electrical (Dk, Df) properties for different types of dielectric polyimides. Among the many low-temperature polyimides we have studied, we focus here on the Fujifilm LTC-9300 series (LTC-9310 and LTC-9320) and the Asahi BL-300 series. The excellent post-curing polymerization ratio (as measured by FT-IR) and film stress results are also described. Finally, a proposed mechanism for these dielectric polyimides’ polymerization under reduced pressure is discussed. |
| Databáze: |
Supplemental Index |
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