Impact of Mold Properties on the Reliability of Ball Grid Array Packaging
Autor: | Carpi, Enio L., Mazon, Talita |
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Zdroj: | ECS Transactions; September 2011, Vol. 39 Issue: 1 |
Abstrakt: | A fatigue model based on viscoplastic material properties and accumulated plastic work was applied to predict crack initiation and crack propagation on Pb-free solder joints. The fatigue model relies on finite element analysis of Ball Grid array electronic packages and Design of Experiments methodology to explore the impact of mold material properties and thickness on the package reliability. It was observed that the outermost solder joint has the lowest failure free life in agreement with the literature. |
Databáze: | Supplemental Index |
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